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| APM9966CO Dual N-Channel Enhancement Mode MOSFET Features * 20V/6A, RDS(ON) =20m(typ.) @ VGS =4.5V RDS(ON) =25m(typ.) @ VGS =2.5V Pin Description * * * Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant) Top View of TSSOP - 8 (1) D1 (8) D2 Applications (4) G1 (5) G2 * Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems. S1 S1 (2) (3) S2 S2 (6) (7) N-Channel MOSFET Ordering and Marking Information APM 9966C Lead Free Code Handling Code Tem p. Range Package Code Package Code O : TSSO P-8 Operating Junction Tem p. Range C : -55 to 150C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : O riginal Device XXXXX - Date Code APM 9966C O : APM 9966C XXXXX Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 1 www.anpec.com.tw APM9966CO Absolute Maximum Ratings Symbol VDSS VGSS ID* IDM* IS* TJ TSTG PD* RJA* Note: *Surface Mounted on 1in pad area, t 10sec. 2 (TA = 25C unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 300s Pulsed Drain Current Diode Continuous Forward Current Maximum Junction Temperature Storage Temperature Range Maximum Power Dissipation Thermal Resistance-Junction to Ambient TA=25C TA=100C VGS=4.5V Rating 20 10 6 20 1.7 150 -55 to 150 1.25 0.5 100 Unit V A A C W C/W Electrical Characteristics Symbol Parameter (TA = 25C unless otherwise noted) Test Condition APM9966CO Min. Typ. Max. Unit Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS VGS(th) IGSS RDS(ON) VSD a a VGS=0V, IDS=250A VDS=16V, VGS=0V TJ=85C VDS=VGS, IDS=250A VGS=10V, VDS=0V VGS=4.5V, IDS=6A VGS=2.5V, IDS=5.2A ISD=1.7A, VGS=0V 20 1 30 0.45 0.6 20 25 0.8 1 100 24 30 1.3 V A V nA m V Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage b Gate Charge Characteristics Qg Total Gate Charge Qgs Qgd Gate-Drain Charge 21.7 VDS=10V, VGS=4.5V, IDS=6A 8.5 2.1 28 nC Gate-Source Charge Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 2 www.anpec.com.tw APM9966CO Electrical Characteristics (Cont.) Symbol Parameter (TA = 25C unless otherwise noted) Test Condition APM9966CO Min. Typ. Max. Unit Dynamic Characteristics b RG Ciss Coss Crss td(ON) Tr td(OFF) Tf Notes: a : Pulse test ; pulse width300s, duty cycle2%. b : Guaranteed by design, not subject to production testing. Gate Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time VGS=0V,VDS=0V,F=1MHz VGS=0V, VDS=15V, Frequency=1.0MHz 2 780 165 105 25 47 42 122 67 22 67 36 pF VDD=10V, RL=10, IDS=1A, VGEN=4.5V, RG=6 ns Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 3 www.anpec.com.tw APM9966CO Typical Characteristics Power Dissipation 1.5 8 Drain Current 1.2 6 0.9 ID - Drain Current (A) Ptot - Power (W) 4 0.6 2 0.3 o 0.0 TA=25 C 0 20 40 60 80 100 120 140 160 TA=25 C,VG=4.5V 0 0 20 40 60 80 100 120 140 160 o Tj - Junction Temperature (C) Tj - Junction Temperature (C) Safe Operation Area Normalized Transient Thermal Resistance 100 2 1 Thermal Transient Impedance Duty = 0.5 0.2 ID - Drain Current (A) im it Rd s( on )L 10 300s 1ms 0.1 0.05 0.02 0.01 0.1 1 10ms 100ms 0.01 Single Pulse 2 0.1 1s DC 0.01 0.01 TA=25 C 0.1 1 10 100 o 1E-3 1E-4 Mounted on 1in pad o RJA : 100 C/W 1E-3 0.01 0.1 1 10 30 VDS - Drain - Source Voltage (V) Square Wave Pulse Duration (sec) Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 4 www.anpec.com.tw APM9966CO Typical Characteristics (Cont.) Output Characteristics 20 18 16 VGS= 2,3,4,5,6,7,8,9,10V 50 45 Drain-Source On Resistance RDS(ON) - On - Resistance (m) 40 35 30 25 VGS=4.5V 20 15 10 5 VGS=2.5V ID - Drain Current (A) 14 12 10 8 6 4 2 1V 0 0 2 4 6 8 10 1.5V 0 0 4 8 12 16 20 VDS - Drain-Source Voltage (V) ID - Drain Current (A) Transfer Characteristics 20 Gate Threshold Voltage 1.6 IDS= 250A 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25 16 12 8 Tj=125 C o o 4 Tj=25 C o Tj=-55 C 0 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 Normalized Threshold Voltage ID - Drain Current (A) 0 25 50 75 100 125 150 VGS - Gate - Source Voltage (V) Tj - Junction Temperature (C) Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 5 www.anpec.com.tw APM9966CO Typical Characteristics (Cont.) Drain-Source On Resistance 2.4 VGS= 4.5V ID = 6A 20 10 Tj=150 C o Source-Drain Diode Forward Normalized On Resistance 2.0 1.6 1.2 IS - Source Current (A) 1 Tj=25 C o 0.8 0.4 RON@Tj=25 C: 20m 0 25 50 75 100 125 150 0.1 0.0 0.3 0.6 0.9 1.2 1.5 1.8 o 0.0 -50 -25 Tj - Junction Temperature (C) VSD - Source - Drain Voltage (V) Capacitance 1200 Frequency=1MHz Gate Charge 5 VDS=10V ID=6A VGS - Gate - source Voltage (V) 20 1000 4 C - Capacitance (pF) 800 Ciss 3 600 2 400 Coss Crss 0 200 1 0 4 8 12 16 0 0 4 8 12 16 20 24 VDS - Drain - Source Voltage (V) QG - Gate Charge (nC) Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 6 www.anpec.com.tw APM9966CO Packaging Information TSSOP-8 e 87 2x E/2 E1 E S ( 2) GAUGE PLANE 1 2 e/2 D A2 A b A1 0.25 L (L1) ( 3) 1 Dim A A1 A2 b D e E E1 L L1 R R1 S 1 2 3 Millimeters Min. 0.00 0.80 0.19 2.9 0.65 BSC 6.40 BSC 4.30 0.45 1.0 REF 0.09 0.09 0.2 0 12 REF 12 REF 0.004 0.004 0.008 0 4.50 0.75 0.169 0.018 Max. 1.2 0.15 1.05 0.30 3.1 Min. 0.000 0.031 0.007 0.114 Inches Max. 0.047 0.006 0.041 0.012 0.122 0.026 BSC 0.252 BSC 0.177 0.030 0.039REF 8 8 12 REF 12 REF Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 7 www.anpec.com.tw APM9966CO Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) TP R am p-up tp C ritical Zone T L to T P T e m p e ra tu re TL T sm ax tL T sm in R am p-down ts Preheat 25 t 25 C to Peak T im e Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 8 www.anpec.com.tw APM9966CO Classification Reflow Profiles(Cont.) Table 1. SnPb Entectic Process - Package Peak Reflow Tem peratures 3 3 Package Thickness Volum e m m Volum e m m <350 350 <2.5 m m 240 +0/-5C 225 +0/-5C 2.5 m m 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Tem peratures 3 3 3 Package Thickness Volum e mm Volum e mm Volum e mm <350 350-2000 >2000 <1.6 m m 260 +0C* 260 +0C* 260 +0C* 1.6 m m - 2.5 m m 260 +0C* 250 +0C* 245 +0C* 2.5 m m 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and including the stated classification tem perature (this m eans Peak reflow tem perature +0C. For exam ple 260C+0C) at the rated MSL level. Reliability Test Program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles Carrier Tape & Reel Dimensions t E Po P P1 D F W Bo Ao D1 Ko Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 9 www.anpec.com.tw APM9966CO Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Application A 330 1 B 62 +1.5 D 1.5 + 0.1 C 12.75+ 0.15 D1 1.5 + 0.1 J 2 + 0.5 Po 4.0 0.1 T1 12.4 0.2 P1 2.0 0.1 T2 2 0.2 Ao 7.0 0.1 W 12 0. 3 Bo 3.6 0.3 P 8 0.1 Ko E 1.750.1 t TSSOP-8 F 5.5 0. 1 1.6 0.1 0.30.013 (mm) Cover Tape Dimensions Application TSSOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 10 www.anpec.com.tw |
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